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Leaded BGA solder balls
14876
$7.00
In stock
1
Product Details
COST PRICE:
2.08,2.05,3.00, 3.02 (.25)
Location:
Shelf 5
LAST ORDER RECEIVED DATE:
3/17/21, 1/12/21, 10/14
These are the leaded solder balls that we use for reballing larger chips, such as iPhone 6/6+ baseband CPU. Placing solder balls in a stencil as an alternative to solder paste ensures that the formed balls are all perfectly even. Solder balls in this size are the ones we use for reballing most iPhone chips.
Quantity of 25,000.
Sizes .25mm .20mm .30mm
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