
Single stencil for Direct BGA eMMC / eMCP (221 153 169 254 162 186 ) for rebailing BGA memory eMMC / EMCP chips found in phones and tablets.
Specification:
- Material: Stainless steel
- Type of stencils: direct heating
Application:
- rebelling eMMC and eMCP memory chips after repair / reading (Chip-Off)